Claughton Miller & Associates provide a full range of polishing and lapping films and colloidal silica slurries suitable for the polishing of fiber optic cables and other optoelectronic manufacturing processes.

Lapping Films:

Diamond Films (0.2 - 40µm)
Suitable for polish of ceramics, glass, super hard alloys, sapphire, stone, etc.

Silicon Carbide Films (1.0 - 30µm)
Suitable for polish of stone, super hard alloys, metals, plastics etc.

Alumina Films (0.3 - 40µm)
Engineered for the burnishing process of disk drive media disks
Suitable for polish of metals, stone, plastics, wood, etc.

Cerium Oxide & Silica Films (0.02 – 1.0µm)
Suitable for final polish applications

Diamond Lapping Films

Mesh Size (µm) Color
30000 0.1
10000 0.5
8000 1.0
4000 3.0
2500 6.0
2000 9.0
1200 15.0
600 30.0

Alumina Lapping Films

Mesh Size (µm) Color
15000 0.3
10000 0.5
8000 1.0
6000 2.0
4000 3.0
3000 5.0
2000 9.0
1500 12.0
1200 15.0
600 30.0
400 40.0

 

Silicon Carbide Lapping Films

Mesh Size (µm) Color
8000 1.0
6000 2.0
4000 3.0
3000 5.0
2000 9.0
1200 15.0
600 30.0

High Purity Colloidal Silica Slurries:

  • Made from high purity silicon powder
  • Designed for low sodium content
  • Low metal content
  • Generates angstrom level finish of polished surface
  • Suitable for polishing process of semiconductor wafers, hard disk drive substrates and media disks, fiber optic connectors, etc

Colloidal Silica Slurries Typical Properties

Item Alkaline slurry Acidic slurry
Particle size (nm) 20-40; 40-60; 60-80; 100-140 15-35
Appearance Milky white liquid Milky white liquid
Density (g/ml) 1.15 1.15
pH 9.8±0.5 2-3